Open-ended microwave oven for flip-chip assembly

A. J. Sangster*, K. I. Sinclair, M. P. Y. Desmulliez, G. Goussetis

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


A novel open-ended waveguide cavity resonator for the microwave curing of bumps, underfills and encapsulants is described. The open oven has the potential to provide fast alignment of devices during flip-chip assembly, direct chip attach, surface mount assembly or wafer-scale level packaging. The prototype microwave oven was designed to operate at X-band for ease of testing, although a higher frequency version is planned. The device described in the paper takes the form of a waveguide cavity resonator. It is approximately square in cross-section and is filled with a low-loss dielectric with a relative permittivity of 6. It is excited by end-fed probes in order to couple power preferentially into the TM3,3,k mode with the object of forming nine 'hot-spots' in the open end. Low power tests using heat sensitive film demonstrate clearly that selective heating in multiple locations in the open end of the oven is achievable. © The Institution of Engineering and Technology 2008.

Original languageEnglish
Pages (from-to)53-58
Number of pages6
JournalIET Microwaves, Antennas and Propagation
Issue number1
Publication statusPublished - Feb 2008


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