One step thin-film PV interconnection process using laser and inkjet

M. L. Crozier*, A. N. Brunton, A. Abbas, J. W. Bowers, P. M. Kaminski, J. M. Walls, J. D. Shephard

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)


Monolithic series interconnection is a key advantage of thin-film PV. The standard approach is to alternate layer deposition and laser scribing. Here the M-Solv patented One Step Interconnect (OSI) process is introduced as an alternative to the conventional all laser interconnect. OSI interconnects TF-PV modules in a single step after all deposition is complete with considerable advantages: reduced capital expenditure; better process control; less vacuum/air interfaces, reduced line footprint and faster panel transit. OSI employs a combination of laser scribing and inkjet printing of functional materials. OSI mini-modules have been fabricated on CdTe with good electrical performance. Although the focus here has been CdTe, OSI is applicable to all thin-film technologies. The laser and inkjet processes presented are fully scalable for industrial production.

Original languageEnglish
Title of host publication2013 IEEE 39th Photovoltaic Specialists Conference (PVSC)
Place of PublicationNew York
Number of pages5
Publication statusPublished - 2013
Event39th IEEE Photovoltaic Specialists Conference - Tampa, United Kingdom
Duration: 16 Jun 201321 Jun 2013

Publication series

NameIEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371


Conference39th IEEE Photovoltaic Specialists Conference
Abbreviated titlePVSC
Country/TerritoryUnited Kingdom


  • thin film
  • CdTe
  • silicon
  • CIGS
  • laser
  • inkjet
  • interconnect


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