@inproceedings{578f2f8f634e40348555fb562d7f4b39,
title = "One step thin-film PV interconnection process using laser and inkjet",
abstract = "Monolithic series interconnection is a key advantage of thin-film PV. The standard approach is to alternate layer deposition and laser scribing. Here the M-Solv patented One Step Interconnect (OSI) process is introduced as an alternative to the conventional all laser interconnect. OSI interconnects TF-PV modules in a single step after all deposition is complete with considerable advantages: reduced capital expenditure; better process control; less vacuum/air interfaces, reduced line footprint and faster panel transit. OSI employs a combination of laser scribing and inkjet printing of functional materials. OSI mini-modules have been fabricated on CdTe with good electrical performance. Although the focus here has been CdTe, OSI is applicable to all thin-film technologies. The laser and inkjet processes presented are fully scalable for industrial production.",
keywords = "thin film, CdTe, silicon, CIGS, laser, inkjet, interconnect, ORGANIC SOLAR-CELLS, ELECTRODES",
author = "Crozier, {M. L.} and Brunton, {A. N.} and A. Abbas and Bowers, {J. W.} and Kaminski, {P. M.} and Walls, {J. M.} and Shephard, {J. D.}",
year = "2013",
doi = "10.1109/PVSC.2013.6745181",
language = "English",
series = "IEEE Photovoltaic Specialists Conference",
publisher = "IEEE",
pages = "3411--3415",
booktitle = "2013 IEEE 39th Photovoltaic Specialists Conference (PVSC)",
address = "United States",
note = "39th IEEE Photovoltaic Specialists Conference, PVSC ; Conference date: 16-06-2013 Through 21-06-2013",
}