Monolithic series interconnection is a key advantage of thin-film PV. The standard approach is to alternate layer deposition and laser scribing. Here the M-Solv patented One Step Interconnect (OSI) process is introduced as an alternative to the conventional all laser interconnect. OSI interconnects TF-PV modules in a single step after all deposition is complete with considerable advantages: reduced capital expenditure; better process control; less vacuum/air interfaces, reduced line footprint and faster panel transit. OSI employs a combination of laser scribing and inkjet printing of functional materials. OSI mini-modules have been fabricated on CdTe with good electrical performance. Although the focus here has been CdTe, OSI is applicable to all thin-film technologies. The laser and inkjet processes presented are fully scalable for industrial production.