On variable frequency microwave processing of heterogeneous chip-on-board assemblies

T. Tilford; S. Pavuluri; C. Bailey; M. P Y Desmulliez

doi:10.1109/ICEPT.2009.5270558

On variable frequency microwave processing of heterogeneous chip-on-board assemblies

T. Tilford, S. Pavuluri, C. Bailey, M. P Y Desmulliez

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters. ©2009 IEEE.

Original language	English
Title of host publication	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages	927-931
Number of pages	5
DOIs	https://doi.org/10.1109/ICEPT.2009.5270558
Publication status	Published - 2009
Event	2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China Duration: 10 Aug 2009 → 13 Aug 2009

Conference

Conference	2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated title	ICEPT-HDP 2009
Country/Territory	China
City	Beijing
Period	10/08/09 → 13/08/09

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10.1109/ICEPT.2009.5270558

Cite this

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title = "On variable frequency microwave processing of heterogeneous chip-on-board assemblies",

abstract = "Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters. {\textcopyright}2009 IEEE.",

author = "T. Tilford and S. Pavuluri and C. Bailey and Desmulliez, {M. P Y}",

year = "2009",

doi = "10.1109/ICEPT.2009.5270558",

language = "English",

isbn = "9781424446599",

pages = "927--931",

booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",

note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",

}

Tilford, T, Pavuluri, S, Bailey, C & Desmulliez, MPY 2009, On variable frequency microwave processing of heterogeneous chip-on-board assemblies. in 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. pp. 927-931, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, 10/08/09. https://doi.org/10.1109/ICEPT.2009.5270558

TY - GEN

T1 - On variable frequency microwave processing of heterogeneous chip-on-board assemblies

AU - Tilford, T.

AU - Pavuluri, S.

AU - Bailey, C.

AU - Desmulliez, M. P Y

PY - 2009

Y1 - 2009

N2 - Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters. ©2009 IEEE.

AB - Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters. ©2009 IEEE.

U2 - 10.1109/ICEPT.2009.5270558

DO - 10.1109/ICEPT.2009.5270558

M3 - Conference contribution

SN - 9781424446599

SP - 927

EP - 931

BT - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

T2 - 2009 International Conference on Electronic Packaging Technology and High Density Packaging

Y2 - 10 August 2009 through 13 August 2009

ER -

On variable frequency microwave processing of heterogeneous chip-on-board assemblies

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