On variable frequency microwave processing of heterogeneous chip-on-board assemblies

T. Tilford, S. Pavuluri, C. Bailey, M. P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters. ©2009 IEEE.

Original languageEnglish
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages927-931
Number of pages5
DOIs
Publication statusPublished - 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China
Duration: 10 Aug 200913 Aug 2009

Conference

Conference2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated titleICEPT-HDP 2009
CountryChina
CityBeijing
Period10/08/0913/08/09

Fingerprint Dive into the research topics of 'On variable frequency microwave processing of heterogeneous chip-on-board assemblies'. Together they form a unique fingerprint.

Cite this