On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

Jack H. -G. Ng, David Watson, Joachim Sigwarth, Aongus McCarthy, Kevin A. Prior, Duncan P. Hand, Weixing Yu, Robert W. Kay, Changqing Liu, Marc P. Y. Desmulliez

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Abstract

This paper proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photo and thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.

Original languageEnglish
Pages (from-to)139-147
Number of pages9
JournalIEEE Transactions on Nanotechnology
Volume11
Issue number1
DOIs
Publication statusPublished - Jan 2012

Keywords

  • Direct writing
  • electroless plating
  • flexible substrate
  • interconnections
  • metallization
  • micropatterning
  • packaging
  • photolithography
  • polyimide
  • silver nanoparticles

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