On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

Jack H. -G. Ng; David Watson; Joachim Sigwarth; Aongus McCarthy; Kevin A. Prior; Duncan P. Hand; Weixing Yu; Robert W. Kay; Changqing Liu; Marc P. Y. Desmulliez

doi:10.1109/TNANO.2011.2160092

On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

Jack H. -G. Ng, David Watson, Joachim Sigwarth, Aongus McCarthy, Kevin A. Prior, Duncan P. Hand, Weixing Yu, Robert W. Kay, Changqing Liu, Marc P. Y. Desmulliez

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

This paper proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photo and thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.

Original language	English
Pages (from-to)	139-147
Number of pages	9
Journal	IEEE Transactions on Nanotechnology
Volume	11
Issue number	1
DOIs	https://doi.org/10.1109/TNANO.2011.2160092
Publication status	Published - Jan 2012

Keywords

Direct writing
electroless plating
flexible substrate
interconnections
metallization
micropatterning
packaging
photolithography
polyimide
silver nanoparticles

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10.1109/TNANO.2011.2160092

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title = "On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates",

abstract = "This paper proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photo and thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.",

keywords = "Direct writing , electroless plating , flexible substrate , interconnections, metallization, micropatterning , packaging, photolithography , polyimide , silver nanoparticles ",

author = "Ng, {Jack H. -G.} and David Watson and Joachim Sigwarth and Aongus McCarthy and Prior, {Kevin A.} and Hand, {Duncan P.} and Weixing Yu and Kay, {Robert W.} and Changqing Liu and Desmulliez, {Marc P. Y.}",

year = "2012",

month = jan,

doi = "10.1109/TNANO.2011.2160092",

language = "English",

volume = "11",

pages = "139--147",

journal = "IEEE Transactions on Nanotechnology",

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T1 - On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

AU - Ng, Jack H. -G.

AU - Watson, David

AU - Sigwarth, Joachim

AU - McCarthy, Aongus

AU - Prior, Kevin A.

AU - Hand, Duncan P.

AU - Yu, Weixing

AU - Kay, Robert W.

AU - Liu, Changqing

AU - Desmulliez, Marc P. Y.

PY - 2012/1

Y1 - 2012/1

N2 - This paper proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photo and thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.

AB - This paper proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photo and thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.

KW - Direct writing

KW - electroless plating

KW - flexible substrate

KW - interconnections

KW - metallization

KW - micropatterning

KW - packaging

KW - photolithography

KW - polyimide

KW - silver nanoparticles

U2 - 10.1109/TNANO.2011.2160092

DO - 10.1109/TNANO.2011.2160092

M3 - Article

SN - 1536-125X

VL - 11

SP - 139

EP - 147

JO - IEEE Transactions on Nanotechnology

JF - IEEE Transactions on Nanotechnology

IS - 1

ER -

On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

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Keywords

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