On the integration of microwave curing systems into microelectronics assembly processes

R. Adamietz, G. Müller, N. Othman, F. Eicher, T. Tilford, M. Ferenets, S. K. Pavuluri, M. P Y Desmulliez, C. Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

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Engineering & Materials Science