On the integration of microwave curing systems into microelectronics assembly processes

R. Adamietz, G. Müller, N. Othman, F. Eicher, T. Tilford, M. Ferenets, S. K. Pavuluri, M. P Y Desmulliez, C. Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)


In microelectronics packaging applications a variety of thermosetting polymer materials is applied. Such materials are dispensed in a liquid form and are heated with the intent to cure them. Conventional processes often take several hours to bring the material up to temperatures which result in a significant rate of cure. An alternative approach to curing thermosetting polymers is the use of microwave energy, which has been shown to cure encapsulant materials in substantially shorter times. A recent innovation is the open-ended microwave oven proposed by Sinclair et al. [1]. This paper deals with the implementation of the open-ended microwave oven into a precision placement machine. Two test products for encapsulation and flip-chip serve as objective for microwave-assisted assembly. An integrated system setup including the open ended oven is presented. Modifications on the open-ended microwave oven are described and a concept for the development of an embedded microwave curing system is presented. Tests on curing encapsulant materials dispensed over a commercially available QFN were performed to determine post-process functionality of the package, with no evident detrimental effects.

Original languageEnglish
Title of host publicationElectronics System Integration Technology Conference, ESTC 2010 - Proceedings
Publication statusPublished - 2010
Event3rd Electronics System Integration Technology Conference - Berlin, Germany
Duration: 13 Sept 201016 Sept 2010


Conference3rd Electronics System Integration Technology Conference
Abbreviated titleESTC 2010


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