On the impact of through-silicon-via-induced stress on 65-nm CMOS devices

Roshan Weerasekera*, Hong Yu Li, Lim Wei Yi, Hu Sanming, Jinglin Shi, Je Minkyu, Keng Hwa Teo, Sanming Hu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)

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