Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system

T. Tilford; K. I. Sinclair; G. Goussetis; C. Bailey; M. P Y Desmulliez; A. K. Parrott; A. J. Sangster

doi:10.1109/ESIME.2008.4525086

Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system

T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. P Y Desmulliez, A. K. Parrott, A. J. Sangster

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results. ©2008 IEEE.

Original language	English
Title of host publication	EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
DOIs	https://doi.org/10.1109/ESIME.2008.4525086
Publication status	Published - 2008
Event	EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Freiburg im Breisgau, Germany Duration: 20 Apr 2008 → 23 Apr 2008

Conference

Conference	EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Country/Territory	Germany
City	Freiburg im Breisgau
Period	20/04/08 → 23/04/08

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10.1109/ESIME.2008.4525086

Cite this

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K., & Sangster, A. J. (2008). Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system. In EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems https://doi.org/10.1109/ESIME.2008.4525086

@inproceedings{3d66623a801045ea938a691c75d25317,

title = "Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system",

abstract = "Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results. {\textcopyright}2008 IEEE.",

author = "T. Tilford and Sinclair, {K. I.} and G. Goussetis and C. Bailey and Desmulliez, {M. P Y} and Parrott, {A. K.} and Sangster, {A. J.}",

year = "2008",

doi = "10.1109/ESIME.2008.4525086",

language = "English",

isbn = "9781424421282",

booktitle = "EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems",

note = "EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems ; Conference date: 20-04-2008 Through 23-04-2008",

}

Tilford, T, Sinclair, KI, Goussetis, G, Bailey, C, Desmulliez, MPY, Parrott, AK & Sangster, AJ 2008, Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system. in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems. EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, Freiburg im Breisgau, Germany, 20/04/08. https://doi.org/10.1109/ESIME.2008.4525086

Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system. / Tilford, T.; Sinclair, K. I.; Goussetis, G. et al.
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems. 2008.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system

AU - Tilford, T.

AU - Sinclair, K. I.

AU - Goussetis, G.

AU - Bailey, C.

AU - Desmulliez, M. P Y

AU - Parrott, A. K.

AU - Sangster, A. J.

PY - 2008

Y1 - 2008

N2 - Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results. ©2008 IEEE.

AB - Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results. ©2008 IEEE.

U2 - 10.1109/ESIME.2008.4525086

DO - 10.1109/ESIME.2008.4525086

M3 - Conference contribution

SN - 9781424421282

BT - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

T2 - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Y2 - 20 April 2008 through 23 April 2008

ER -

Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system

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