Numerical Modeling of the Electroplating Process for Microvia Fabrication

Nadia Strusevich, Chris Bailey, Suzanne Costello, Mayur Patel, Marc Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.

Original languageEnglish
Title of host publication2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Place of PublicationNEW YORK
PublisherIEEE
Pages1-6
Number of pages6
ISBN (Print)978-1-4673-6138-5
DOIs
Publication statusPublished - Apr 2013
Event14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw, Poland
Duration: 14 Apr 201317 Apr 2013

Conference

Conference14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
CountryPoland
Period14/04/1317/04/13

Cite this

Strusevich, N., Bailey, C., Costello, S., Patel, M., & Desmulliez, M. (2013). Numerical Modeling of the Electroplating Process for Microvia Fabrication. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-6). IEEE. https://doi.org/10.1109/EuroSimE.2013.6529989