Numerical Modeling of the Electroplating Process for Microvia Fabrication

Nadia Strusevich; Chris Bailey; Suzanne Costello; Mayur Patel; Marc Desmulliez

doi:10.1109/EuroSimE.2013.6529989

Numerical Modeling of the Electroplating Process for Microvia Fabrication

Nadia Strusevich^*, Chris Bailey, Suzanne Costello, Mayur Patel, Marc Desmulliez

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.

Original language	English
Title of host publication	2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Place of Publication	NEW YORK
Publisher	IEEE
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-4673-6138-5
DOIs	https://doi.org/10.1109/EuroSimE.2013.6529989
Publication status	Published - Apr 2013
Event	14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw, Poland Duration: 14 Apr 2013 → 17 Apr 2013

Conference

Conference	14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Country/Territory	Poland
Period	14/04/13 → 17/04/13

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10.1109/EuroSimE.2013.6529989

Cite this

@inproceedings{5711ed5ef1ce4812a7a533a5de263260,

title = "Numerical Modeling of the Electroplating Process for Microvia Fabrication",

abstract = "For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.",

author = "Nadia Strusevich and Chris Bailey and Suzanne Costello and Mayur Patel and Marc Desmulliez",

year = "2013",

month = apr,

doi = "10.1109/EuroSimE.2013.6529989",

language = "English",

isbn = "978-1-4673-6138-5",

pages = "1--6",

booktitle = "2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)",

publisher = "IEEE",

address = "United States",

note = "14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ; Conference date: 14-04-2013 Through 17-04-2013",

}

Strusevich, N, Bailey, C, Costello, S, Patel, M & Desmulliez, M 2013, Numerical Modeling of the Electroplating Process for Microvia Fabrication. in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, NEW YORK, pp. 1-6, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Poland, 14/04/13. https://doi.org/10.1109/EuroSimE.2013.6529989

Numerical Modeling of the Electroplating Process for Microvia Fabrication. / Strusevich, Nadia; Bailey, Chris; Costello, Suzanne et al.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). NEW YORK: IEEE, 2013. p. 1-6.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Numerical Modeling of the Electroplating Process for Microvia Fabrication

AU - Strusevich, Nadia

AU - Bailey, Chris

AU - Costello, Suzanne

AU - Patel, Mayur

AU - Desmulliez, Marc

PY - 2013/4

Y1 - 2013/4

N2 - For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.

AB - For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.

U2 - 10.1109/EuroSimE.2013.6529989

DO - 10.1109/EuroSimE.2013.6529989

M3 - Conference contribution

SN - 978-1-4673-6138-5

SP - 1

EP - 6

BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

PB - IEEE

CY - NEW YORK

T2 - 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Y2 - 14 April 2013 through 17 April 2013

ER -

Numerical Modeling of the Electroplating Process for Microvia Fabrication

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