Numerical analysis of thermal stresses induced during VFM encapsulant curing

T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. P Y Desmulliez, A. K. Parrott, A. J. Sangster

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Encapsulant curing using a Variable Frequency Microwave (VFM) system is analysed numerically. Thermosetting polymer encapsulant materials require an input of heat energy to initiate the cure process. In this article, the heating is considered to be performed by a novel microwave system, able to perform the curing process more rapidly than conventional techniques. Thermal stresses are induced when packages containing materials with differing coefficients of thermal expansion are heated, and cure stresses are induced as thermosetting polymer materials shrink during the cure process. These stresses are developed during processing and remain as residual stresses within the component after the manufacturing process is complete. As residual stresses will directly affect the reliability of the device, it is necessary to assess their magnitude and the effect on package reliability. A coupled multiphysics model has been developed to numerically analyse the microwave curing process. In order to obtain a usefully accurate model of this process, a holistic approach has been taken, in which the process is not considered to be a sequence of discrete steps, but as a complex coupled system. An overview of the implemented numerical model is presented, with particular focus paid to analysis of induced thermal stresses. Results showing distribution of stresses within an idealised microelectronics package are presented and are discussed. ©2008 IEEE.

Original languageEnglish
Title of host publication2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction, ISSE 2008
Pages348-353
Number of pages6
DOIs
Publication statusPublished - 2008
Event2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction - Budapest, Hungary
Duration: 7 May 200811 May 2008

Conference

Conference2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction
Abbreviated titleISSE 2008
CountryHungary
CityBudapest
Period7/05/0811/05/08

Fingerprint Dive into the research topics of 'Numerical analysis of thermal stresses induced during VFM encapsulant curing'. Together they form a unique fingerprint.

  • Cite this

    Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K., & Sangster, A. J. (2008). Numerical analysis of thermal stresses induced during VFM encapsulant curing. In 2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction, ISSE 2008 (pp. 348-353) https://doi.org/10.1109/ISSE.2008.5276666