Numerical analysis of polymer cure kinetics in isotropic conductive adhesives

T. Tilford, J. E. Morris, M. Ferenets, P. R. Rajaguru, S. Pavuluri, M. P Y Desmulliez, C. Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint Dive into the research topics of 'Numerical analysis of polymer cure kinetics in isotropic conductive adhesives'. Together they form a unique fingerprint.

Physics & Astronomy