Numerical analysis of microwave underfill cure in ball-grid packages

T. Tilford, M. Ferenets, R. Adamietz, S. K. Pavuluri, J. E. Morris, M. P Y Desmulliez, C. Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint

Dive into the research topics of 'Numerical analysis of microwave underfill cure in ball-grid packages'. Together they form a unique fingerprint.

INIS

Material Science

Engineering