Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation

Michael Hughes, Nadia Strussevitch, Christopher Bailey, Kevin McManus, Jens Kaufmann, David Flynn, M. P Y Desmulliez

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

Electrodeposition is a widely used technique for the fabrication of high aspect ratio microstructures. In recent years, much research has been focused within this area aiming to understand the physics behind the filling of high aspect ratio vias and trenches on substrates and in particular how they can be made without the formation of voids in the deposited material. This paper reports on the fundamental work towards the advancement of numerical algorithms that can predict the electrodeposition process in micron scaled features. Two different numerical approaches have been developed, which capture the motion of the deposition interface and 2-D simulations are presented for both methods under two deposition regimes: those where surface kinetics is governed by Ohm's law and the Butler-Volmer equation, respectively. In the last part of this paper the modelling of acoustic forces and their subsequent impact on the deposition profile through convection is examined. Copyright © 2009 John Wiley & Sons, Ltd.

Original languageEnglish
Pages (from-to)237-268
Number of pages32
JournalInternational Journal for Numerical Methods in Fluids
Volume64
Issue number3
DOIs
Publication statusPublished - Sep 2010

Keywords

  • CFD
  • Electrodeposition
  • Level set method
  • LIGA
  • Megasonic agitation
  • Microsystems

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