Non-destructive X-Ray mapping of strain & warpage of die in packaged chips

Jennifer Stopford*, Arthur Henry, Dionysios Manessis, Nick Bennett, Ken Horan, David Allen, Jochen Wittge, Lars Boettcher, Aidan Cowley, Patrick McNally

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

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Material Science

Engineering