New thermally crosslinkable electron-beam resists: 1. Itaconic anhydride-methyl methacrylate copolymers

A. F. Miles, J. M G Cowie, R. H. Bennett, D. R. Brambley

Research output: Contribution to journalArticle

Abstract

This paper describes the lithographic evaluation of copolymers of itaconic anhydride (IT.ANH) and methyl methacrylate (MMA) as thermally crosslinkable electron-beam resists. Their properties were investigated as a function of copolymer composition and primary number-average molecular weight in order to determine an optimum formulation for the preparation of high-resolution resist patterns. Line and space test patterns with features smaller than 0.5 µm have been prepared using a copolymer containing 46 mol% IT.ANH with Mn = 5.30 × 105 g mol-1, which was thermally crosslinked by pre-baking at 170°C for 1 h. The electron exposure dose required to solubilise the resist (aD) has been shown to be very much less than the exposure dose required for the preparation of high-resolution resist patterns. © 1991.

Original languageEnglish
Pages (from-to)484-488
Number of pages5
JournalPolymer
Volume32
Issue number3
Publication statusPublished - 1991

Keywords

  • electron-beam lithography
  • gel degradation
  • itaconic anhydride copolymers
  • resist materials

Fingerprint Dive into the research topics of 'New thermally crosslinkable electron-beam resists: 1. Itaconic anhydride-methyl methacrylate copolymers'. Together they form a unique fingerprint.

Cite this