Near-eutectic Sn-Ag-Cu solder bumps formation for flip-chip interconnection by electrodeposition

Yi Qin, Changqing Liu, G. D. Wilcox, Kun Zhao, Changhai Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint Dive into the research topics of 'Near-eutectic Sn-Ag-Cu solder bumps formation for flip-chip interconnection by electrodeposition'. Together they form a unique fingerprint.

Physics & Astronomy