INIS
applications
100%
simulation
100%
microwave radiation
100%
microelectronics
100%
curing
100%
packaging
100%
polymers
80%
design
60%
data
20%
distribution
20%
mapping
20%
values
20%
solutions
20%
algorithms
20%
volume
20%
heating
20%
coupling
20%
processing
20%
precision
20%
sampling
20%
optimization
20%
testing
20%
numerical analysis
20%
heating rate
20%
microwave ovens
20%
physics
20%
Engineering
Microwave Curing
100%
Polymer Material
100%
Microelectronics
100%
Electronic Packaging
100%
Numerical Model
66%
Prototype
33%
Experimental Result
33%
Induced Stress
33%
Individual Component
33%
Time Domain
33%
Development Process
33%
Electromagnetic Analysis
33%
Finite Volume Method
33%
Material Property Data
33%
Limitations
33%
Heating Rate
33%
Material Science
Thermoset Plastics
100%
Materials Property
50%
Cure Process
50%
Finite Difference
50%
Electronic Circuit
50%