Abstract
Nano-Imprint Forming (NIF) as manufacturing technology is ideally placed to enable high resolution, low-cost and high-throughput fabrication of three-dimensional fine structures and the packaging of heterogeneous micro-systems [1]. This paper details a thermo-mechanical modelling methodology for optimising this process for different materials used in components such as mini-fluidics and bio-chemical systems, optoelectronics, photonics and health usage monitoring systems (HUMS). This work is part of a major UK Grand Challenge project - 3D-Mintegration - which is aiming to develop modelling and design technologies for the next generation of fabrication, assembly and test processes for 3D-miniaturised systems. ©2008 IEEE.
| Original language | English |
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| Title of host publication | EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems |
| DOIs | |
| Publication status | Published - 2008 |
| Event | EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Freiburg im Breisgau, Germany Duration: 20 Apr 2008 → 23 Apr 2008 |
Conference
| Conference | EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems |
|---|---|
| Country/Territory | Germany |
| City | Freiburg im Breisgau |
| Period | 20/04/08 → 23/04/08 |
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