Abstract
In this paper are presented the diaphragm deflection and output voltage obtained by applying a series of pressure loads to a silicon piezoresistive micro-diaphragm with built-in edges. Sensors of different length and thickness of diaphragms as well as various resistors lengths have been modelled and simulated using Finite Element Analysis methods. The resulting values of the membrane deflection and output vokage are compared with experimental and numerical data. The absolute value of the output voltage and its variation with respect to physical parameters are shown to depend on i.) the resistor length, ii) its placement within the diaphragm and iii.) the thickness of the diaphragm.
Original language | English |
---|---|
Pages (from-to) | 327-336 |
Number of pages | 10 |
Journal | Proceedings of SPIE - the International Society for Optical Engineering |
Volume | 4407 |
DOIs | |
Publication status | Published - 2001 |
Event | MEMS Design, Fabrication, Characterization, and Packaging - Edinburgh, United Kingdom Duration: 30 May 2001 → 1 Jun 2001 |
Keywords
- Finite Element Analysis (FEA)
- Micro-diaphragm
- Modelling
- Piezoresistive
- Pressure sensor
- Silicon micromachining