Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering

Research output: Contribution to conference › Paper

Original language	English
Pages	69-82 ?isbn
Publication status	Published - 1999
Event	Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. - Duration: 1 Jan 1999 → …

Conference	Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics.
Period	1/01/99 → …
Other	Eds. T Winkler and A Schubert

Cite this

@conference{2734111e45c94161a1b6d0b2436350d2,

title = "Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering",

author = "Muller, \{W H\} and Albrecht, \{H J\} and W Dreyer and T Hauck and J Jendrny and R Tilgner",

year = "1999",

language = "English",

pages = "69--82 ?isbn",

note = "Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. ; Conference date: 01-01-1999",

}

TY - CONF

T1 - Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering

AU - Muller, W H

AU - Albrecht, H J

AU - Dreyer, W

AU - Hauck, T

AU - Jendrny, J

AU - Tilgner, R

PY - 1999

Y1 - 1999

M3 - Paper

SP - 69-82 ?isbn

T2 - Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics.

Y2 - 1 January 1999

ER -