| Original language | English |
|---|---|
| Pages | 69-82 ?isbn |
| Publication status | Published - 1999 |
| Event | Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. - Duration: 1 Jan 1999 → … |
Conference
| Conference | Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. |
|---|---|
| Period | 1/01/99 → … |
| Other | Eds. T Winkler and A Schubert |
Cite this
Muller, W. H., Albrecht, H. J., Dreyer, W., Hauck, T., Jendrny, J., & Tilgner, R. (1999). Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering. 69-82 ?isbn. Paper presented at Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. , .
@conference{2734111e45c94161a1b6d0b2436350d2,
title = "Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering",
author = "Muller, {W H} and Albrecht, {H J} and W Dreyer and T Hauck and J Jendrny and R Tilgner",
year = "1999",
language = "English",
pages = "69--82 ?isbn",
note = "Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. ; Conference date: 01-01-1999",
}
Muller, WH, Albrecht, HJ, Dreyer, W, Hauck, T, Jendrny, J & Tilgner, R 1999, 'Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering' Paper presented at Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. , 1/01/99, pp. 69-82 ?isbn.
Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering. / Muller, W H; Albrecht, H J; Dreyer, W; Hauck, T; Jendrny, J; Tilgner, R.
1999. 69-82 ?isbn Paper presented at Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. , .Research output: Contribution to conference › Paper
TY - CONF
T1 - Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering
AU - Muller, W H
AU - Albrecht, H J
AU - Dreyer, W
AU - Hauck, T
AU - Jendrny, J
AU - Tilgner, R
PY - 1999
Y1 - 1999
M3 - Paper
SP - 69-82 ?isbn
ER -
Muller WH, Albrecht HJ, Dreyer W, Hauck T, Jendrny J, Tilgner R. Modeling the lifetime of microelectronic components: A challenge for material science and computational engineering. 1999. Paper presented at Proc. Materials Mechanics, Fracture Mechanics, Micro Mechanics. , .