Modeling diffusional coarsening in eutectic tin/lead solders: a quantitative approach

W. Dreyer, Wolfgang Muller

Research output: Contribution to journalArticlepeer-review

44 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Modeling diffusional coarsening in eutectic tin/lead solders: a quantitative approach'. Together they form a unique fingerprint.

INIS

Material Science

Engineering