Millimeter-Wave Substrate Integrated Corrugation Loaded H-Plane Horn Antenna with Beamwidth and Back Radiation Suppression

Weiguang Song, Zhenxiang Yi, Lei Wang

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)
82 Downloads (Pure)


This letter presents a wideband substrate-integrated H-plane horn antenna loaded with a novel E-plane corrugation. Classical substrate integrated waveguide (SIW) H-plane horn antennas suffer from poor impedance matching, large E-plane half-power beamwidth, and strong back radiation due to the thinness of the substrates. A substrate-integrated E-plane corrugation is introduced as an effective solution, implemented using the multilayer printed circuit board technique. The elaborated corrugated SIW horn is well matched with reflection coefficients less than -10 dB from 26 to 40 GHz. The back radiation suppression reflected by front-to-back ratios is improved to minimum 20 dB and up to 40 dB in the entire Ka-band. Furthermore, the corrugation reduces the half-power beamwidth of the E-plane radiation patterns successfully, e.g., from 180° to 80° at 30 GHz, whereas the H-plane patterns are maintained and unaffected. Consequently, the antenna gain is well enhanced. A prototype of the corrugated horn is fabricated and then measured. The measurement is in good agreement with the simulation. The proposed corrugated SIW horn antenna is compact in a planar structure so as to easy integration and array deployment. The wide bandwidth, narrow E-plane half-power beamwidth and low back radiation make it very promising for applications as millimeter-wave probes or handset antennas.

Original languageEnglish
Pages (from-to)2402-2406
Number of pages5
JournalIEEE Antennas and Wireless Propagation Letters
Issue number10
Early online date26 Jun 2023
Publication statusPublished - Oct 2023


  • Corrugated horn
  • E-plane corrugation
  • H-plane horn
  • front-to-back ratio (FTBR)
  • substrate-integrated waveguide (SIW)
  • wideband

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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