Millimeter-wave printed circuit board characterization using substrate integrated waveguide resonators

Dmitry E. Zelenchuk*, Vincent Fusco, George Goussetis, Antonio Mendez, David Linton

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

36 Citations (Scopus)


This paper proposes a substrate integrated waveguide (SIW) cavity-based method that is compliant with ground-signal-ground (GSG) probing technology for dielectric characterization of printed circuit board materials at millimeter wavelengths. This paper presents the theory necessary to retrieve dielectric parameters from the resonant characteristics of SIW cavities with particular attention placed on the coupling scheme and means for obtaining the unloaded resonant frequency. Different sets of samples are designed and measured to address the influence of the manufacturing process on the method. Material parameters are extracted at V- and W-band from measured data with the effect of surface roughness of the circuit metallization taken into account.

Original languageEnglish
Pages (from-to)3300-3308
Number of pages9
JournalIEEE Transactions on Microwave Theory and Techniques
Issue number10
Publication statusPublished - Oct 2012


  • substrate integrated waveguide (SIW)
  • ground-signal-ground (GSG) probing
  • dielectric-constant
  • dielectric characterization
  • form
  • wireless communications
  • resonator
  • millimeter-wave (mm-wave) measurement


Dive into the research topics of 'Millimeter-wave printed circuit board characterization using substrate integrated waveguide resonators'. Together they form a unique fingerprint.

Cite this