An organic copper ink with 9.6 wt% of Cu content derived from a short carbon chain organic copper precursor was successfully applied on a modified PI substrate and easily formed a favorable conductive copper film by self-reduction in the sintering process, which showed excellent conductivity. The effects of sintering temperature and time on the microstructure and conductivity action of the copper films were studied by XRD, EDS and SEM and electrical measurements, respectively. The sheet resistance and resistivity were determined to be as low as 0.11 Ω/□ and 2.2 × 10<sup>−5</sup> Ω·cm. The conduction mechanism is discussed in terms of the percolation theory.
|Number of pages||10|
|Journal||Journal of Materials Science: Materials in Electronics|
|Early online date||14 Aug 2015|
|Publication status||Published - 2015|
ASJC Scopus subject areas
- Condensed Matter Physics
- Atomic and Molecular Physics, and Optics
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
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- School of Engineering & Physical Sciences - Associate Professor
- School of Engineering & Physical Sciences, Institute of Chemical Sciences - Associate Professor
Person: Academic (Research & Teaching)