Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content

Wen-dong Yang, Changhai Wang, Valeria Arrighi, Chun-yan Liu, David Watson

Research output: Contribution to journalArticle

13 Citations (Scopus)
92 Downloads (Pure)

Abstract

An organic copper ink with 9.6 wt% of Cu content derived from a short carbon chain organic copper precursor was successfully applied on a modified PI substrate and easily formed a favorable conductive copper film by self-reduction in the sintering process, which showed excellent conductivity. The effects of sintering temperature and time on the microstructure and conductivity action of the copper films were studied by XRD, EDS and SEM and electrical measurements, respectively. The sheet resistance and resistivity were determined to be as low as 0.11 Ω/□ and 2.2 × 10<sup>−5</sup> Ω·cm. The conduction mechanism is discussed in terms of the percolation theory.

Original languageEnglish
Pages (from-to)8973-8982
Number of pages10
JournalJournal of Materials Science: Materials in Electronics
Volume26
Issue number11
Early online date14 Aug 2015
DOIs
Publication statusPublished - 2015

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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