Abstract
A novel method to manufacture and assemble a microinductor that is based on flip-chip bonding is described in this article. The microinductor is developed for DC-DC converters operating in the MHz switching frequency. The fabricated inductors have an inductance ranging from 0.3µH to 180µH. An optimum Q-factor of 14 was attained at 1MHz. Cobalt-Copper-iron cores maintained a constant inductance across a 1 kHz-1MHz bandwidth. The thin film laminate minimizes the eddy current loss and the hysteresis loss was negligible. Impedance increases linearly with frequency indicating that parasitic capacitance effects in this frequency range are negligible. The microinductor operated at an efficiency of 92% at 1MHz achieving a power density of 3.75 W/mm3. © 2005 IEEE.
Original language | English |
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Title of host publication | Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging |
Pages | 192-198 |
Number of pages | 7 |
Volume | 2005 |
DOIs | |
Publication status | Published - 2005 |
Event | EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan Duration: 11 Dec 2005 → 14 Dec 2005 |
Conference
Conference | EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging |
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Country/Territory | Japan |
City | Tokyo |
Period | 11/12/05 → 14/12/05 |
Keywords
- Magnetic MEMS
- Power supplies
- DC-DC power conversion
- materials