MicroLens/UV-LED array packaging for dynamic and static alignment

M. Luetzelschwab; M. P Y Desmulliez; D. Weiland

doi:10.1109/ESTC.2008.4684509

MicroLens/UV-LED array packaging for dynamic and static alignment

M. Luetzelschwab, M. P Y Desmulliez, D. Weiland

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120°C. ©2008 IEEE.

Original language	English
Title of host publication	Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages	1121-1126
Number of pages	6
DOIs	https://doi.org/10.1109/ESTC.2008.4684509
Publication status	Published - 2008
Event	2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008

Conference

Conference	2008 2nd Electronics Systemintegration Technology Conference
Abbreviated title	ESTC
Country/Territory	United Kingdom
City	Greenwich
Period	1/09/08 → 4/09/08

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10.1109/ESTC.2008.4684509

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@inproceedings{683e4de87b2e4ba09af8c43355c6834a,

title = "MicroLens/UV-LED array packaging for dynamic and static alignment",

abstract = "This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120°C. {\textcopyright}2008 IEEE.",

author = "M. Luetzelschwab and Desmulliez, \{M. P Y\} and D. Weiland",

year = "2008",

doi = "10.1109/ESTC.2008.4684509",

language = "English",

isbn = "9781424428144",

pages = "1121--1126",

booktitle = "Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC",

note = "2008 2nd Electronics Systemintegration Technology Conference, ESTC ; Conference date: 01-09-2008 Through 04-09-2008",

}

TY - GEN

T1 - MicroLens/UV-LED array packaging for dynamic and static alignment

AU - Luetzelschwab, M.

AU - Desmulliez, M. P Y

AU - Weiland, D.

PY - 2008

Y1 - 2008

N2 - This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120°C. ©2008 IEEE.

AB - This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120°C. ©2008 IEEE.

U2 - 10.1109/ESTC.2008.4684509

DO - 10.1109/ESTC.2008.4684509

M3 - Conference contribution

SN - 9781424428144

SP - 1121

EP - 1126

BT - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

T2 - 2008 2nd Electronics Systemintegration Technology Conference

Y2 - 1 September 2008 through 4 September 2008

ER -

MicroLens/UV-LED array packaging for dynamic and static alignment

Abstract

Conference

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