Abstract
This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120°C. ©2008 IEEE.
Original language | English |
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Title of host publication | Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC |
Pages | 1121-1126 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 2008 |
Event | 2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008 |
Conference
Conference | 2008 2nd Electronics Systemintegration Technology Conference |
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Abbreviated title | ESTC |
Country/Territory | United Kingdom |
City | Greenwich |
Period | 1/09/08 → 4/09/08 |