This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120°C. ©2008 IEEE.
|Title of host publication||Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC|
|Number of pages||6|
|Publication status||Published - 2008|
|Event||2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom|
Duration: 1 Sept 2008 → 4 Sept 2008
|Conference||2008 2nd Electronics Systemintegration Technology Conference|
|Period||1/09/08 → 4/09/08|