MicroLens/UV-LED array packaging for dynamic and static alignment

M. Luetzelschwab, M. P Y Desmulliez, D. Weiland

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120°C. ©2008 IEEE.

Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages1121-1126
Number of pages6
DOIs
Publication statusPublished - 2008
Event2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom
Duration: 1 Sep 20084 Sep 2008

Conference

Conference2008 2nd Electronics Systemintegration Technology Conference
Abbreviated titleESTC
CountryUnited Kingdom
CityGreenwich
Period1/09/084/09/08

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