Abstract
Interconnects are a necessity in microfluidic assembly to link micro or nanoscale features to workable platforms and provide world-to-chip access. Packaging issues can hold back progress in microfluidic or biosensor projects and are recognised an underestimated challenge in microfluidic manufacturing and production. Conventionally interconnections between microfluidic modules are obtained via a screw fastening or clamping systems both reliant on operator screw torque which can modify flow behaviour from one module to the other and in turn affect fluidic related performance such as hydrodynamic separation efficiencies. The proposed solution is a microfluidic snap-fit assembly. We described the design, model and test of a snap-fit package enabled by additive manufacturing for microfluidic applications.
Original language | English |
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Title of host publication | Advances in Manufacturing Technology XXXI |
Editors | James Gao, Mohammed El Souri, Simeon Keates |
Place of Publication | Amsterdam |
Publisher | IOS Press |
Pages | 129-134 |
Number of pages | 6 |
Volume | 6 |
ISBN (Electronic) | 9781614997924 |
ISBN (Print) | 9781614997917 |
DOIs | |
Publication status | Published - 2017 |
Event | 15th International Conference on Manufacturing Research: Incorporating the 32nd National Conference on Manufacturing Research - The University of Greenwich, London, United Kingdom Duration: 5 Sept 2017 → 7 Sept 2017 http://www.icmr.org.uk/ICMR2017/index.html (Conference website) https://www.waset.org/conference/2017/03/osaka/ICMR (Conference website) |
Publication series
Name | Advances in Transcdisciplinary Engineering |
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Publisher | IOS Press |
Volume | 6 |
ISSN (Print) | 2352-751X |
ISSN (Electronic) | 2352-7528 |
Conference
Conference | 15th International Conference on Manufacturing Research |
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Abbreviated title | ICMR 2017 |
Country/Territory | United Kingdom |
City | London |
Period | 5/09/17 → 7/09/17 |
Other | The International Conference on Manufacturing Research (ICMR2017) will take place from 5 to 7 September 2017 on the main campus of the University of Greenwich, London, UK. It will include keynote presentations by internationally renowned researchers and industrialists, as well as papers from academia and industry, exploring all core areas of manufacturing engineering. |
Internet address |
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Keywords
- Additive manufacturing
- Microfluidic packaging
- Snap-fit
ASJC Scopus subject areas
- Computer Science Applications
- Industrial and Manufacturing Engineering
- Software
- Algebra and Number Theory
- Strategy and Management