Microfluidic snap-fit assembly enabled by additive manufacturing

Mohamed Ashour, Maïwenn Kersaudy-Kerhoas*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter (peer-reviewed)peer-review


Interconnects are a necessity in microfluidic assembly to link micro or nanoscale features to workable platforms and provide world-to-chip access. Packaging issues can hold back progress in microfluidic or biosensor projects and are recognised an underestimated challenge in microfluidic manufacturing and production. Conventionally interconnections between microfluidic modules are obtained via a screw fastening or clamping systems both reliant on operator screw torque which can modify flow behaviour from one module to the other and in turn affect fluidic related performance such as hydrodynamic separation efficiencies. The proposed solution is a microfluidic snap-fit assembly. We described the design, model and test of a snap-fit package enabled by additive manufacturing for microfluidic applications.

Original languageEnglish
Title of host publicationAdvances in Manufacturing Technology XXXI
EditorsJames Gao, Mohammed El Souri, Simeon Keates
Place of PublicationAmsterdam
PublisherIOS Press
Number of pages6
ISBN (Electronic)9781614997924
ISBN (Print)9781614997917
Publication statusPublished - 2017
Event15th International Conference on Manufacturing Research: Incorporating the 32nd National Conference on Manufacturing Research - The University of Greenwich, London, United Kingdom
Duration: 5 Sept 20177 Sept 2017
http://www.icmr.org.uk/ICMR2017/index.html (Conference website)
https://www.waset.org/conference/2017/03/osaka/ICMR (Conference website)

Publication series

NameAdvances in Transcdisciplinary Engineering
PublisherIOS Press
ISSN (Print)2352-751X
ISSN (Electronic)2352-7528


Conference15th International Conference on Manufacturing Research
Abbreviated titleICMR 2017
Country/TerritoryUnited Kingdom
OtherThe International Conference on Manufacturing Research (ICMR2017) will take place from 5 to 7 September 2017 on the main campus of the University of Greenwich, London, UK. It will include keynote presentations by internationally renowned researchers and industrialists, as well as papers from academia and industry, exploring all core areas of manufacturing engineering.
Internet address


  • Additive manufacturing
  • Microfluidic packaging
  • Snap-fit

ASJC Scopus subject areas

  • Computer Science Applications
  • Industrial and Manufacturing Engineering
  • Software
  • Algebra and Number Theory
  • Strategy and Management


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