As more advanced and high density photonics devices in 2D format have been developed, the need for more advanced microoptical components that allow the manipulation of light from, and interconnection between these arrays of devices in the third dimension. A number of available technologies for realizing the optical interconnects is discussed.
|Proceedings of SPIE - the International Society for Optical Engineering
|Published - 2000
|Optics in Computing 2000 - Quebec City, Can
Duration: 18 Jun 2000 → 23 Jun 2000