Even if it is clear that MEMS are an emergence of microelectronic technologies, taking advantage of the mechanical properties of silicon and silicon compound materials, their heterogeneous and complex nature, the new approach in their packaging and interconnections, modify deeply the way to check the level of confidence in their working conditions. The purpose of this paper is therefore to present a methodology for the reliability study of MEMS through the development of a virtual prototyping taking account of failure mechanisms, with VHDL-AMS language. This approach based on a behavioral MEMS modeling in working conditions combined with failure mechanisms injection is illustrated through Wobble electrostatic motors. © 2003 Elsevier Ltd. All rights reserved.
|Number of pages||5|
|Publication status||Published - Sep 2003|
|Event||14th European Symposium on Reliability of Electron Devices - Bordeaux, France, France|
Duration: 7 Oct 2003 → 10 Oct 2003