Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Tom Jones; David Flynn; Marc Phillipe Yves Desmulliez

doi:10.1109/DTIP.2016.7514855

Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Tom Jones, David Flynn, Marc Phillipe Yves Desmulliez

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.

Original language	English
Title of host publication	2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Publisher	IEEE
ISBN (Print)	9781509014576
DOIs	https://doi.org/10.1109/DTIP.2016.7514855
Publication status	Published - 2 Jun 2016
Event	18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2016 - Danubius Hotel Gellert, Budapest, Hungary Duration: 30 May 2016 → 2 Jun 2016

Conference

Conference	18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2016
Abbreviated title	DTIP 2016
Country/Territory	Hungary
City	Budapest
Period	30/05/16 → 2/06/16

Keywords

Megasonic agitation
Electroplating
Manufacturing

Access to Document

10.1109/DTIP.2016.7514855

Cite this

@inproceedings{6bfffcf920534237be5e99d18c90c684,

title = "Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry",

abstract = "Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves. ",

keywords = "Megasonic agitation, Electroplating, Manufacturing",

author = "Tom Jones and David Flynn and Desmulliez, {Marc Phillipe Yves}",

year = "2016",

month = jun,

day = "2",

doi = "10.1109/DTIP.2016.7514855",

language = "English",

isbn = "9781509014576",

booktitle = "2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)",

publisher = "IEEE",

address = "United States",

note = "18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2016, DTIP 2016 ; Conference date: 30-05-2016 Through 02-06-2016",

}

Jones, T, Flynn, D & Desmulliez, MPY 2016, Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry. in 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)., 7514855, IEEE, 18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2016, Budapest, Hungary, 30/05/16. https://doi.org/10.1109/DTIP.2016.7514855

TY - GEN

T1 - Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

AU - Jones, Tom

AU - Flynn, David

AU - Desmulliez, Marc Phillipe Yves

PY - 2016/6/2

Y1 - 2016/6/2

N2 - Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.

AB - Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.

KW - Megasonic agitation

KW - Electroplating

KW - Manufacturing

U2 - 10.1109/DTIP.2016.7514855

DO - 10.1109/DTIP.2016.7514855

M3 - Conference contribution

SN - 9781509014576

BT - 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

PB - IEEE

T2 - 18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2016

Y2 - 30 May 2016 through 2 June 2016

ER -

Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Abstract

Conference

Keywords

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