Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Megasonic (1MHz) acoustic agitation has been applied to Printed Circuit Board (PCB) surfaces to aid copper electroplating efficiency through enhancement of electrolyte solution transport. Evidence for microbubble acoustic transient cavitation has been observed on the PCB surface, which is attributed as the cause of adverse plating finishes. Additional acoustic artefacts are reported as ridge-like structures of peak-to-trough of 20 µm and are associated with the possible occurrence of Rayleigh-wave surface acoustic waves.
Original languageEnglish
Title of host publication2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
PublisherIEEE
ISBN (Print)9781509014576
DOIs
Publication statusPublished - 2 Jun 2016
Event18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2016 - Danubius Hotel Gellert, Budapest, Hungary
Duration: 30 May 20162 Jun 2016

Conference

Conference18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2016
Abbreviated titleDTIP 2016
CountryHungary
CityBudapest
Period30/05/162/06/16

Keywords

  • Megasonic agitation
  • Electroplating
  • Manufacturing

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  • Cite this

    Jones, T., Flynn, D., & Desmulliez, M. P. Y. (2016). Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry. In 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) [7514855] IEEE. https://doi.org/10.1109/DTIP.2016.7514855