Megasonic enhanced electrodeposition

Jens Kaufmann; M. P Y Desmulliez; Dennis Price

doi:10.1109/DTIP.2008.4753020

Megasonic enhanced electrodeposition

Jens Kaufmann, M. P Y Desmulliez, Dennis Price

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

A novel way of filling high aspect ratio vertical interconnection (microvias) is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are therefore possible for the manufacturing of interconnections and metal-based MEMS. ©EDA Publishing/DTIP 2008.

Original language	English
Title of host publication	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Pages	370-372
Number of pages	3
DOIs	https://doi.org/10.1109/DTIP.2008.4753020
Publication status	Published - 2008
Event	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France Duration: 9 Apr 2008 → 11 Apr 2008

Conference

Conference	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Country/Territory	France
City	Nice
Period	9/04/08 → 11/04/08

Access to Document

10.1109/DTIP.2008.4753020

Cite this

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title = "Megasonic enhanced electrodeposition",

abstract = "A novel way of filling high aspect ratio vertical interconnection (microvias) is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are therefore possible for the manufacturing of interconnections and metal-based MEMS. {\textcopyright}EDA Publishing/DTIP 2008.",

author = "Jens Kaufmann and Desmulliez, \{M. P Y\} and Dennis Price",

year = "2008",

doi = "10.1109/DTIP.2008.4753020",

language = "English",

isbn = "9782355000065",

pages = "370--372",

booktitle = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS",

note = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; Conference date: 09-04-2008 Through 11-04-2008",

}

TY - GEN

T1 - Megasonic enhanced electrodeposition

AU - Kaufmann, Jens

AU - Desmulliez, M. P Y

AU - Price, Dennis

PY - 2008

Y1 - 2008

N2 - A novel way of filling high aspect ratio vertical interconnection (microvias) is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are therefore possible for the manufacturing of interconnections and metal-based MEMS. ©EDA Publishing/DTIP 2008.

AB - A novel way of filling high aspect ratio vertical interconnection (microvias) is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are therefore possible for the manufacturing of interconnections and metal-based MEMS. ©EDA Publishing/DTIP 2008.

UR - https://www.scopus.com/pages/publications/58149085976

U2 - 10.1109/DTIP.2008.4753020

DO - 10.1109/DTIP.2008.4753020

M3 - Conference contribution

SN - 9782355000065

SP - 370

EP - 372

BT - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

T2 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Y2 - 9 April 2008 through 11 April 2008

ER -

Megasonic enhanced electrodeposition

Abstract

Conference

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