Megasonic enhanced electrodeposition

Jens Kaufmann, M. P Y Desmulliez, Dennis Price

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

A novel way of filling high aspect ratio vertical interconnection (microvias) is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are therefore possible for the manufacturing of interconnections and metal-based MEMS. ©EDA Publishing/DTIP 2008.

Original languageEnglish
Title of host publicationDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Pages370-372
Number of pages3
DOIs
Publication statusPublished - 2008
EventDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France
Duration: 9 Apr 200811 Apr 2008

Conference

ConferenceDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
CountryFrance
CityNice
Period9/04/0811/04/08

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  • Cite this

    Kaufmann, J., Desmulliez, M. P. Y., & Price, D. (2008). Megasonic enhanced electrodeposition. In DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 370-372) https://doi.org/10.1109/DTIP.2008.4753020