A novel way of filling high aspect ratio vertical interconnection (microvias) is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are therefore possible for the manufacturing of interconnections and metal-based MEMS. ©EDA Publishing/DTIP 2008.
|Title of host publication||DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS|
|Number of pages||3|
|Publication status||Published - 2008|
|Event||DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France|
Duration: 9 Apr 2008 → 11 Apr 2008
|Conference||DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS|
|Period||9/04/08 → 11/04/08|