| Original language | English |
|---|---|
| Pages (from-to) | 13-19 |
| Number of pages | 7 |
| Journal | Journal of the Institute of Circuit Technology |
| Volume | 10 |
| Issue number | 1 |
| Publication status | Published - 2017 |
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MACFEST: Benchmarking a new solder-able finish for the PCB industry
- Thomas Jones
Research output: Contribution to journal › Article › peer-review
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