Low temperature wafer-level packaging of MEMS using selective laser bonding

Norbert Lorenz, Martin D. Smith, Duncan P. Hand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In recent years there has been significant interest in the development of new types of Micro-Electro-Mechanical-Systems (MEMS) and related microdevices but the issue of packaging remains a problem in many cases, and is indeed a particular challenge for their commercialisation. Current hermetic bonding techniques involve heating the whole device to high temperatures, in some cases combined with strong electric fields. This prevents the use of temperature-sensitive materials within the package (e.g. polymer and magnetic materials). We have therefore been developing alternative solutions based on the use of a laser as a truly localised heat source to drive an intermediate layer bonding process. In this paper we describe laser-based packaging of silicon to glass - materials commonly used in MEMS fabrication - on a wafer-level, where multiple devices are packaged on a single silicon wafer. The bonding is achieved by using a Benzocyclobutene intermediate layer. Previously we have demonstrated bonding of a simplified pattern of 5 individual packages on the same chip as a proof of principle. In this work we present packaging of more complex and more closely spaced patterns and the issues involved in such processes when using laser bonding.

Original languageEnglish
Title of host publication29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Congress Proceedings
Pages871-876
Number of pages6
Volume103
Publication statusPublished - 2010
Event29th International Congress on Applications of Lasers and Electro-Optics - Anaheim, CA, United States
Duration: 26 Sep 201030 Sep 2010

Conference

Conference29th International Congress on Applications of Lasers and Electro-Optics
Abbreviated titleICALEO 2010
CountryUnited States
CityAnaheim, CA
Period26/09/1030/09/10

Keywords

  • BCB
  • Laser joining
  • Localized heating
  • Wafer-level packaging

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