Low temperature flip-chip packaging based on screen printing technology

Robert Kay; Marc Phillipe Yves Desmulliez; C Bailey; G Glinski; S Stoyavic; N N Ekere; R Durairaj; M Hendriksen; B Smith; D Price; A Roberts; M Whitmore; P Ongley; J Gourlay

Low temperature flip-chip packaging based on screen printing technology

Robert Kay, Marc Phillipe Yves Desmulliez, C Bailey, G Glinski, S Stoyavic, N N Ekere, R Durairaj, M Hendriksen, B Smith, D Price, A Roberts, M Whitmore, P Ongley, J Gourlay

School of Engineering & Physical Sciences

Research output: Contribution to conference › Paper

Original language	English
Publication status	Published - 2003
Event	Proc of the IMAPS MicroTech Conference - Ettington Chase, United Kingdom Duration: 1 Jan 2003 → …

Conference

Conference	Proc of the IMAPS MicroTech Conference
Country/Territory	United Kingdom
City	Ettington Chase
Period	1/01/03 → …

Cite this

@conference{8d63370d2d484f1e898ddee8a10b9ac9,

title = "Low temperature flip-chip packaging based on screen printing technology",

author = "Robert Kay and Desmulliez, {Marc Phillipe Yves} and C Bailey and G Glinski and S Stoyavic and Ekere, {N N} and R Durairaj and M Hendriksen and B Smith and D Price and A Roberts and M Whitmore and P Ongley and J Gourlay",

year = "2003",

language = "English",

note = "Proc of the IMAPS MicroTech Conference ; Conference date: 01-01-2003",

}

TY - CONF

T1 - Low temperature flip-chip packaging based on screen printing technology

AU - Kay, Robert

AU - Desmulliez, Marc Phillipe Yves

AU - Bailey, C

AU - Glinski, G

AU - Stoyavic, S

AU - Ekere, N N

AU - Durairaj, R

AU - Hendriksen, M

AU - Smith, B

AU - Price, D

AU - Roberts, A

AU - Whitmore, M

AU - Ongley, P

AU - Gourlay, J

PY - 2003

Y1 - 2003

M3 - Paper

T2 - Proc of the IMAPS MicroTech Conference

Y2 - 1 January 2003

ER -