Low temperature flip-chip packaging based on screen printing technology

Robert Kay, Marc Phillipe Yves Desmulliez, C Bailey, G Glinski, S Stoyavic, N N Ekere, R Durairaj, M Hendriksen, B Smith, D Price, A Roberts, M Whitmore, P Ongley, J Gourlay

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2003
EventProc of the IMAPS MicroTech Conference - Ettington Chase, United Kingdom
Duration: 1 Jan 2003 → …

Conference

ConferenceProc of the IMAPS MicroTech Conference
CountryUnited Kingdom
CityEttington Chase
Period1/01/03 → …

Cite this

Kay, R., Desmulliez, M. P. Y., Bailey, C., Glinski, G., Stoyavic, S., Ekere, N. N., Durairaj, R., Hendriksen, M., Smith, B., Price, D., Roberts, A., Whitmore, M., Ongley, P., & Gourlay, J. (2003). Low temperature flip-chip packaging based on screen printing technology. Paper presented at Proc of the IMAPS MicroTech Conference, Ettington Chase, United Kingdom.