Low temperature flip-chip packaging based on screen printing technology

Robert Kay, Marc Phillipe Yves Desmulliez, C Bailey, G Glinski, S Stoyavic, N N Ekere, R Durairaj, M Hendriksen, B Smith, D Price, A Roberts, M Whitmore, P Ongley, J Gourlay

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2003
EventProc of the IMAPS MicroTech Conference - Ettington Chase, United Kingdom
Duration: 1 Jan 2003 → …

Conference

ConferenceProc of the IMAPS MicroTech Conference
CountryUnited Kingdom
CityEttington Chase
Period1/01/03 → …

Cite this

Kay, R., Desmulliez, M. P. Y., Bailey, C., Glinski, G., Stoyavic, S., Ekere, N. N., ... Gourlay, J. (2003). Low temperature flip-chip packaging based on screen printing technology. Paper presented at Proc of the IMAPS MicroTech Conference, Ettington Chase, United Kingdom.
Kay, Robert ; Desmulliez, Marc Phillipe Yves ; Bailey, C ; Glinski, G ; Stoyavic, S ; Ekere, N N ; Durairaj, R ; Hendriksen, M ; Smith, B ; Price, D ; Roberts, A ; Whitmore, M ; Ongley, P ; Gourlay, J. / Low temperature flip-chip packaging based on screen printing technology. Paper presented at Proc of the IMAPS MicroTech Conference, Ettington Chase, United Kingdom.
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title = "Low temperature flip-chip packaging based on screen printing technology",
author = "Robert Kay and Desmulliez, {Marc Phillipe Yves} and C Bailey and G Glinski and S Stoyavic and Ekere, {N N} and R Durairaj and M Hendriksen and B Smith and D Price and A Roberts and M Whitmore and P Ongley and J Gourlay",
year = "2003",
language = "English",
note = "Proc of the IMAPS MicroTech Conference ; Conference date: 01-01-2003",

}

Kay, R, Desmulliez, MPY, Bailey, C, Glinski, G, Stoyavic, S, Ekere, NN, Durairaj, R, Hendriksen, M, Smith, B, Price, D, Roberts, A, Whitmore, M, Ongley, P & Gourlay, J 2003, 'Low temperature flip-chip packaging based on screen printing technology', Paper presented at Proc of the IMAPS MicroTech Conference, Ettington Chase, United Kingdom, 1/01/03.

Low temperature flip-chip packaging based on screen printing technology. / Kay, Robert; Desmulliez, Marc Phillipe Yves; Bailey, C; Glinski, G; Stoyavic, S; Ekere, N N; Durairaj, R; Hendriksen, M; Smith, B; Price, D; Roberts, A; Whitmore, M; Ongley, P; Gourlay, J.

2003. Paper presented at Proc of the IMAPS MicroTech Conference, Ettington Chase, United Kingdom.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Low temperature flip-chip packaging based on screen printing technology

AU - Kay, Robert

AU - Desmulliez, Marc Phillipe Yves

AU - Bailey, C

AU - Glinski, G

AU - Stoyavic, S

AU - Ekere, N N

AU - Durairaj, R

AU - Hendriksen, M

AU - Smith, B

AU - Price, D

AU - Roberts, A

AU - Whitmore, M

AU - Ongley, P

AU - Gourlay, J

PY - 2003

Y1 - 2003

M3 - Paper

ER -

Kay R, Desmulliez MPY, Bailey C, Glinski G, Stoyavic S, Ekere NN et al. Low temperature flip-chip packaging based on screen printing technology. 2003. Paper presented at Proc of the IMAPS MicroTech Conference, Ettington Chase, United Kingdom.