Localised laser joining of glass to silicon with BCB intermediate layer

Q. Wu, S. Kloss, N. Lorenz, C. Wang, A. J. Moore, D. P. Hand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The use of a laser to provide localised heating is an ideal solution to the problem of packaging micro-electro-mechanical-systems (MEMS) whilst maintaining a low device temperature to avoid changes in temperature-sensitive materials. In this paper we present localised laser bonding of glass to silicon (normally used as the MEMS substrate) by using a fibre-delivered high power laser diode array to cure an intermediate layer of the thermosetting polymer Benzocyclobutene (BCB). In our experiments, we use two techniques to realise localised heating: one is by using a scanning focused laser beam; the other is to use an axicon together with a conventional positive lens to generate a ring focus. Finite Element (FE) simulation indicates that both techniques should keep the temperature in the centre of the package to approximately that of the ambient environment (300 K) during the process, confirmed experimentally by the use of a temperature-sensitive paint. However, the ring focus technique was shown to produce superior bonds.

Original languageEnglish
Title of host publication3rd Pacific International Conference on Applications of Lasers and Optics, PICALO 2008 - Conference Proceedings
Pages859-863
Number of pages5
Publication statusPublished - 2008
Event3rd Pacific International Conference on Applications of Lasers and Optics - Beijing, China
Duration: 16 Apr 200818 Apr 2008

Conference

Conference3rd Pacific International Conference on Applications of Lasers and Optics
Abbreviated titlePICALO 2008
CountryChina
CityBeijing
Period16/04/0818/04/08

Keywords

  • BCB
  • Laser joining
  • Localised heating

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    Wu, Q., Kloss, S., Lorenz, N., Wang, C., Moore, A. J., & Hand, D. P. (2008). Localised laser joining of glass to silicon with BCB intermediate layer. In 3rd Pacific International Conference on Applications of Lasers and Optics, PICALO 2008 - Conference Proceedings (pp. 859-863)