Lifetime and damage assessment for CSPs and related microelectronic structures: Experimental validation plus computer modeling

W H Muller, H J Albrecht, Ch Birzer, J Jendrny, H Pape, B Schwarz, H Teichmann, R Tilgner

Research output: Contribution to conference › Paper

Original language	English
Pages	49-56
Number of pages	8
Publication status	Published - 1998
Event	Proceedings of the 2nd Electronics Packaging Technology Conference - , Singapore Duration: 8 Dec 1998 → 10 Dec 1998

Conference	Proceedings of the 2nd Electronics Packaging Technology Conference
Country/Territory	Singapore
Period	8/12/98 → 10/12/98

Cite this

@conference{ed8990247bb94fc7b542a7a2da0de523,

title = "Lifetime and damage assessment for CSPs and related microelectronic structures: Experimental validation plus computer modeling",

author = "Muller, {W H} and Albrecht, {H J} and Ch Birzer and J Jendrny and H Pape and B Schwarz and H Teichmann and R Tilgner",

year = "1998",

language = "English",

pages = "49--56",

note = "Proceedings of the 2nd Electronics Packaging Technology Conference ; Conference date: 08-12-1998 Through 10-12-1998",

}

TY - CONF

T1 - Lifetime and damage assessment for CSPs and related microelectronic structures: Experimental validation plus computer modeling

AU - Muller, W H

AU - Albrecht, H J

AU - Birzer, Ch

AU - Jendrny, J

AU - Pape, H

AU - Schwarz, B

AU - Teichmann, H

AU - Tilgner, R

PY - 1998

Y1 - 1998

M3 - Paper

SP - 49

EP - 56

T2 - Proceedings of the 2nd Electronics Packaging Technology Conference

Y2 - 8 December 1998 through 10 December 1998

ER -