Lifetime and damage assessment for CSPs and related microelectronic structures: Experimental validation plus computer modeling

W H Muller, H J Albrecht, Ch Birzer, J Jendrny, H Pape, B Schwarz, H Teichmann, R Tilgner

Research output: Contribution to conferencePaper

3 Citations (Scopus)
Original languageEnglish
Pages49-56
Number of pages8
Publication statusPublished - 1998
EventProceedings of the 2nd Electronics Packaging Technology Conference - , Singapore
Duration: 8 Dec 199810 Dec 1998

Conference

ConferenceProceedings of the 2nd Electronics Packaging Technology Conference
CountrySingapore
Period8/12/9810/12/98

Cite this

Muller, W. H., Albrecht, H. J., Birzer, C., Jendrny, J., Pape, H., Schwarz, B., Teichmann, H., & Tilgner, R. (1998). Lifetime and damage assessment for CSPs and related microelectronic structures: Experimental validation plus computer modeling. 49-56. Paper presented at Proceedings of the 2nd Electronics Packaging Technology Conference, Singapore.