Abstract
This paper presents the limitations of the helium leak test when applied to typical MEMS packages. A novel closed-form expression is presented which allows the determination of the minimum cavity volume package that can be accurately tested using the helium leak test method in conjunction with a standard gross leak test. This expression can be used to find optimum test parameters for packages with cavity volumes greater than 2.6 × 10-3 cm3. Hermeticity testing using FTIR and Raman spectroscopy are considered as potential methods to overcome the limitations of the helium leak test method. © 2011 Springer-Verlag.
| Original language | English |
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| Pages (from-to) | 677-684 |
| Number of pages | 8 |
| Journal | Microsystem Technologies |
| Volume | 17 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - Apr 2011 |