Leak detection methods for glass capped and polymer sealed MEMS packages

Suzanne Millar, M. P Y Desmulliez, Stewart McCracken

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials. © 2010 EDA Publishing/DTIP.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Pages10-15
Number of pages6
Publication statusPublished - 2010
EventSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 - Seville, Spain
Duration: 5 May 20107 May 2010

Conference

ConferenceSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
CountrySpain
CitySeville
Period5/05/107/05/10

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