This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials. © 2010 EDA Publishing/DTIP.
|Title of host publication||Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010|
|Number of pages||6|
|Publication status||Published - 2010|
|Event||Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 - Seville, Spain|
Duration: 5 May 2010 → 7 May 2010
|Conference||Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010|
|Period||5/05/10 → 7/05/10|