Leak detection methods for glass capped and polymer sealed MEMS packages

Suzanne Millar; M. P Y Desmulliez; Stewart McCracken

Leak detection methods for glass capped and polymer sealed MEMS packages

Suzanne Millar, M. P Y Desmulliez, Stewart McCracken

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials. © 2010 EDA Publishing/DTIP.

Original language	English
Title of host publication	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Pages	10-15
Number of pages	6
Publication status	Published - 2010
Event	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 - Seville, Spain Duration: 5 May 2010 → 7 May 2010

Conference

Conference	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Country/Territory	Spain
City	Seville
Period	5/05/10 → 7/05/10

Cite this

@inproceedings{9a090e36bde44b95a0d9463bef9f5318,

title = "Leak detection methods for glass capped and polymer sealed MEMS packages",

abstract = "This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials. {\textcopyright} 2010 EDA Publishing/DTIP.",

author = "Suzanne Millar and Desmulliez, {M. P Y} and Stewart McCracken",

year = "2010",

language = "English",

isbn = "9782355000119",

pages = "10--15",

booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010",

note = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 ; Conference date: 05-05-2010 Through 07-05-2010",

}

TY - GEN

T1 - Leak detection methods for glass capped and polymer sealed MEMS packages

AU - Millar, Suzanne

AU - Desmulliez, M. P Y

AU - McCracken, Stewart

PY - 2010

Y1 - 2010

N2 - This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials. © 2010 EDA Publishing/DTIP.

AB - This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations and can be considered to determine leak rates caused by outgassing or permeation through package materials. © 2010 EDA Publishing/DTIP.

UR - http://www.scopus.com/inward/record.url?scp=77957836221&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9782355000119

SP - 10

EP - 15

BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010

T2 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010

Y2 - 5 May 2010 through 7 May 2010

ER -

Leak detection methods for glass capped and polymer sealed MEMS packages

Abstract

Conference

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