Laser Sintering of Nano-Ag Particle Paste for High Temperature Electronics Assembly

Wei Liu, Changhai Wang, Chunqing Wang, Xin Jiang, Xi Huang

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)
169 Downloads (Pure)

Abstract

In this paper, we have investigated a laser-assistedfast nano-Ag sintering process for die attach in power electronicapplications. The effects of laser power, irradiation time, and loadon microstructure and shear performance of the bonded samplesare presented. Moreover, samples sintered by a hotplate werealso studied as a comparison. The results indicate that the dieattachprocess using the nano-Ag material can be realized within1 min in the laser-assisted sintering method. In general, bettershear strength was obtained with increasing laser power, irradiationtime, and load. The shear strength of samples irradiatedby 2–5 min of laser beam was comparable to that of the samplessintered on the hotplate for 80 min.
Original languageEnglish
Pages (from-to)1050-1057
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume7
Issue number7
Early online date10 May 2017
DOIs
Publication statusPublished - Jul 2017

Keywords

  • Laser sintering
  • bonding

Fingerprint Dive into the research topics of 'Laser Sintering of Nano-Ag Particle Paste for High Temperature Electronics Assembly'. Together they form a unique fingerprint.

Cite this