Laser Sintering of Nano-Ag Particle Paste for High Temperature Electronics Assembly

Wei Liu; Changhai Wang; Chunqing Wang; Xin Jiang; Xi Huang

doi:10.1109/TCPMT.2017.2696967

Laser Sintering of Nano-Ag Particle Paste for High Temperature Electronics Assembly

Wei Liu, Changhai Wang, Chunqing Wang, Xin Jiang, Xi Huang

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Abstract

In this paper, we have investigated a laser-assistedfast nano-Ag sintering process for die attach in power electronicapplications. The effects of laser power, irradiation time, and loadon microstructure and shear performance of the bonded samplesare presented. Moreover, samples sintered by a hotplate werealso studied as a comparison. The results indicate that the dieattachprocess using the nano-Ag material can be realized within1 min in the laser-assisted sintering method. In general, bettershear strength was obtained with increasing laser power, irradiationtime, and load. The shear strength of samples irradiatedby 2–5 min of laser beam was comparable to that of the samplessintered on the hotplate for 80 min.

Original language	English
Pages (from-to)	1050-1057
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	7
Issue number	7
Early online date	10 May 2017
DOIs	https://doi.org/10.1109/TCPMT.2017.2696967
Publication status	Published - Jul 2017

Keywords

Laser sintering
bonding

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10.1109/TCPMT.2017.2696967

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Changhai Wang
- C.Wanghw.acuk
- School of Engineering & Physical Sciences - Associate Professor
- School of Engineering & Physical Sciences, Institute of Sensors, Signals & Systems - Associate Professor
Person: Academic (Research & Teaching)

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title = "Laser Sintering of Nano-Ag Particle Paste for High Temperature Electronics Assembly",

abstract = "In this paper, we have investigated a laser-assistedfast nano-Ag sintering process for die attach in power electronicapplications. The effects of laser power, irradiation time, and loadon microstructure and shear performance of the bonded samplesare presented. Moreover, samples sintered by a hotplate werealso studied as a comparison. The results indicate that the dieattachprocess using the nano-Ag material can be realized within1 min in the laser-assisted sintering method. In general, bettershear strength was obtained with increasing laser power, irradiationtime, and load. The shear strength of samples irradiatedby 2–5 min of laser beam was comparable to that of the samplessintered on the hotplate for 80 min.",

keywords = "Laser sintering, bonding ",

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AU - Liu, Wei

AU - Wang, Changhai

AU - Wang, Chunqing

AU - Jiang, Xin

AU - Huang, Xi

PY - 2017/7

Y1 - 2017/7

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AB - In this paper, we have investigated a laser-assistedfast nano-Ag sintering process for die attach in power electronicapplications. The effects of laser power, irradiation time, and loadon microstructure and shear performance of the bonded samplesare presented. Moreover, samples sintered by a hotplate werealso studied as a comparison. The results indicate that the dieattachprocess using the nano-Ag material can be realized within1 min in the laser-assisted sintering method. In general, bettershear strength was obtained with increasing laser power, irradiationtime, and load. The shear strength of samples irradiatedby 2–5 min of laser beam was comparable to that of the samplessintered on the hotplate for 80 min.

KW - Laser sintering

KW - bonding

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M3 - Article

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VL - 7

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

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ER -

Laser Sintering of Nano-Ag Particle Paste for High Temperature Electronics Assembly

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