Laser cutting of thick ceramic tile

I. Black; K. L. Chua

doi:10.1016/S0030-3992(97)00005-4

Laser cutting of thick ceramic tile

I. Black, K. L. Chua

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

58 Citations (Scopus)

Abstract

This paper details developments in the CO₂ laser cutting of thick ceramic tiles, that is thicknesses of 8.5 mm and 9.2 mm. These tiles were cut at a combination of different cutting speeds to determine the necessary cutting parameters for various tile geometries. Different cutting modes were used in conjunction with different cutting speeds to investigate cut quality after laser processing. The work also looked into the effects on cutting through using various shield gases. Multipass cutting and underwater cutting were performed to examine their effects on thermal load during processing. © 1997 Elsevier Science Ltd.

Original language	English
Pages (from-to)	193-205
Number of pages	13
Journal	Optics and Laser Technology
Volume	29
Issue number	4
DOIs	https://doi.org/10.1016/S0030-3992(97)00005-4
Publication status	Published - Jun 1997

Keywords

Advanced cutting processes
Ceramic materials
Laser (CO 2 )

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10.1016/S0030-3992(97)00005-4

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title = "Laser cutting of thick ceramic tile",

abstract = "This paper details developments in the CO2 laser cutting of thick ceramic tiles, that is thicknesses of 8.5 mm and 9.2 mm. These tiles were cut at a combination of different cutting speeds to determine the necessary cutting parameters for various tile geometries. Different cutting modes were used in conjunction with different cutting speeds to investigate cut quality after laser processing. The work also looked into the effects on cutting through using various shield gases. Multipass cutting and underwater cutting were performed to examine their effects on thermal load during processing. {\textcopyright} 1997 Elsevier Science Ltd.",

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AU - Black, I.

AU - Chua, K. L.

PY - 1997/6

Y1 - 1997/6

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AB - This paper details developments in the CO2 laser cutting of thick ceramic tiles, that is thicknesses of 8.5 mm and 9.2 mm. These tiles were cut at a combination of different cutting speeds to determine the necessary cutting parameters for various tile geometries. Different cutting modes were used in conjunction with different cutting speeds to investigate cut quality after laser processing. The work also looked into the effects on cutting through using various shield gases. Multipass cutting and underwater cutting were performed to examine their effects on thermal load during processing. © 1997 Elsevier Science Ltd.

KW - Advanced cutting processes

KW - Ceramic materials

KW - Laser (CO 2 )

U2 - 10.1016/S0030-3992(97)00005-4

DO - 10.1016/S0030-3992(97)00005-4

M3 - Article

SN - 0030-3992

VL - 29

SP - 193

EP - 205

JO - Optics and Laser Technology

JF - Optics and Laser Technology

IS - 4

ER -

Laser cutting of thick ceramic tile

Abstract

Keywords

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