Laser-based joining for the packaging of miniature optoelectronic devices

Duncan P. Hand, Norbert Lorenz, Martin D. Smith, Suzanne Millar, Marc Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In recent years various techniques have been developed for the manufacture of microsystems and other miniature optoelectronic devices. One aspect where there remains significant room for improvement is the packaging process. Standard packaging techniques involve heating whole devices to high temperatures, in some cases combined with strong electric fields, preventing the use of temperature-sensitive materials within the package and generating problems in manufacturing processes where a number of thermal process steps are carried out sequentially, when a later heating step can cause parts joined earlier to disassemble. Here we describe the successful application of laser-based joining for the packaging of such devices. © 2010 Copyright SPIE - The International Society for Optical Engineering.

Original languageEnglish
Title of host publicationLaser-based Micro- and Nanopackaging and Assembly IV
Volume7585
DOIs
Publication statusPublished - 2010
EventFiber Lasers VII: Technology, Systems, and Applications - San Francisco, CA, United States
Duration: 25 Jan 201028 Jan 2010

Conference

ConferenceFiber Lasers VII: Technology, Systems, and Applications
CountryUnited States
CitySan Francisco, CA
Period25/01/1028/01/10

Keywords

  • Laser joining
  • Localised heating
  • Vacuum packaging
  • Wafer-level

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  • Cite this

    Hand, D. P., Lorenz, N., Smith, M. D., Millar, S., & Desmulliez, M. (2010). Laser-based joining for the packaging of miniature optoelectronic devices. In Laser-based Micro- and Nanopackaging and Assembly IV (Vol. 7585) https://doi.org/10.1117/12.841280