Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices

Changhai Wang (Inventor), Duncan Paul Hand (Inventor), Fabrice Bardin (Inventor)

Research output: Patent

Abstract

The present application relates to a system (51) and method for bonding surfaces that allows the production of microcavities suitable for accommodating MEMs devices or other devices that require cavity encapsulation or sealing. Laser directing means (55) are used to selectively direct a laser beam (53) onto an area of a surface to selectively heat the area of the surface in thermal contact with a curable adhesive to cause the curable adhesive to bond to the surface. The laser may be directed to the curable adhesive using a mask (57) , optical manipulation of the beam (53) or a combination of these techniques. The system and method reduce the stressing of the substrate by targeting the heat onto the areas, which require heat to cure the adhesive.
Original languageEnglish
Patent numberPCT/GB2006/001971
IPCB23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01)
Priority date27/05/05
Publication statusPublished - 30 Nov 2006

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packaging
adhesives
microelectromechanical systems
heat
lasers
Mars Excursion Module
sealing
manipulators
electric contacts
masks
laser beams
cavities
causes

Cite this

Wang, C., Hand, D. P., & Bardin, F. (2006). IPC No. B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01). Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices. (Patent No. PCT/GB2006/001971).
Wang, Changhai (Inventor) ; Hand, Duncan Paul (Inventor) ; Bardin, Fabrice (Inventor). / Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices. IPC No.: B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01). Patent No.: PCT/GB2006/001971.
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title = "Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices",
abstract = "The present application relates to a system (51) and method for bonding surfaces that allows the production of microcavities suitable for accommodating MEMs devices or other devices that require cavity encapsulation or sealing. Laser directing means (55) are used to selectively direct a laser beam (53) onto an area of a surface to selectively heat the area of the surface in thermal contact with a curable adhesive to cause the curable adhesive to bond to the surface. The laser may be directed to the curable adhesive using a mask (57) , optical manipulation of the beam (53) or a combination of these techniques. The system and method reduce the stressing of the substrate by targeting the heat onto the areas, which require heat to cure the adhesive.",
author = "Changhai Wang and Hand, {Duncan Paul} and Fabrice Bardin",
note = "Bibliographic data: WO2006126015 (A1) ― 2006-11-30; PCT/GB2006/001971; B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01)",
year = "2006",
month = "11",
day = "30",
language = "English",
type = "Patent",

}

Wang, C, Hand, DP & Bardin, F 2006, Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices, Patent No. PCT/GB2006/001971, IPC No. B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01).

Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices. / Wang, Changhai (Inventor); Hand, Duncan Paul (Inventor); Bardin, Fabrice (Inventor).

IPC No.: B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01). Patent No.: PCT/GB2006/001971.

Research output: Patent

TY - PAT

T1 - Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices

AU - Wang, Changhai

AU - Hand, Duncan Paul

AU - Bardin, Fabrice

N1 - Bibliographic data: WO2006126015 (A1) ― 2006-11-30

PY - 2006/11/30

Y1 - 2006/11/30

N2 - The present application relates to a system (51) and method for bonding surfaces that allows the production of microcavities suitable for accommodating MEMs devices or other devices that require cavity encapsulation or sealing. Laser directing means (55) are used to selectively direct a laser beam (53) onto an area of a surface to selectively heat the area of the surface in thermal contact with a curable adhesive to cause the curable adhesive to bond to the surface. The laser may be directed to the curable adhesive using a mask (57) , optical manipulation of the beam (53) or a combination of these techniques. The system and method reduce the stressing of the substrate by targeting the heat onto the areas, which require heat to cure the adhesive.

AB - The present application relates to a system (51) and method for bonding surfaces that allows the production of microcavities suitable for accommodating MEMs devices or other devices that require cavity encapsulation or sealing. Laser directing means (55) are used to selectively direct a laser beam (53) onto an area of a surface to selectively heat the area of the surface in thermal contact with a curable adhesive to cause the curable adhesive to bond to the surface. The laser may be directed to the curable adhesive using a mask (57) , optical manipulation of the beam (53) or a combination of these techniques. The system and method reduce the stressing of the substrate by targeting the heat onto the areas, which require heat to cure the adhesive.

M3 - Patent

M1 - PCT/GB2006/001971

ER -

Wang C, Hand DP, Bardin F, inventors. Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices. B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01). 2006 Nov 30.