Laser assisted polymer bonding technology for advanced MEMS packaging

J. Zeng, C. H. Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents the development of a laser assisted polymer bonding process using benzocyclobutene (BCB) for encapsulation of MEMS and other microscale sensor devices. The polymer rings were fabricated on capping substrates using the photosensitive BCB resin and photolithography and then bonded onto device substrates to form microcavities for MEMS packaging. A high-power fibre-coupled diode laser at the wavelength of 970 nm was used as the heat source for BCB bonding/curing in conjunction with novel beam forming optics that allows selective illumination of the substrates to be joined. Defect free bonding was realised in 10 seconds using laser power of order 50 Wand 1 kgf of bonding force. The quality of the laser produced polymer bond was assessed using optical inspection and leak test and it was shown that it is as good as that formed using conventional hotplate based approach, but reducing the bonding time by a factor of ~100. ©2008 IEEE.

Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages1225-1229
Number of pages5
DOIs
Publication statusPublished - 2008
Event2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom
Duration: 1 Sep 20084 Sep 2008

Conference

Conference2008 2nd Electronics Systemintegration Technology Conference
Abbreviated titleESTC
CountryUnited Kingdom
CityGreenwich
Period1/09/084/09/08

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  • Cite this

    Zeng, J., & Wang, C. H. (2008). Laser assisted polymer bonding technology for advanced MEMS packaging. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 1225-1229) https://doi.org/10.1109/ESTC.2008.4684528