Laser assisted polymer bonding technology for advanced MEMS packaging

J. Zeng; C. H. Wang

doi:10.1109/ESTC.2008.4684528

Laser assisted polymer bonding technology for advanced MEMS packaging

J. Zeng, C. H. Wang

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper presents the development of a laser assisted polymer bonding process using benzocyclobutene (BCB) for encapsulation of MEMS and other microscale sensor devices. The polymer rings were fabricated on capping substrates using the photosensitive BCB resin and photolithography and then bonded onto device substrates to form microcavities for MEMS packaging. A high-power fibre-coupled diode laser at the wavelength of 970 nm was used as the heat source for BCB bonding/curing in conjunction with novel beam forming optics that allows selective illumination of the substrates to be joined. Defect free bonding was realised in 10 seconds using laser power of order 50 Wand 1 kgf of bonding force. The quality of the laser produced polymer bond was assessed using optical inspection and leak test and it was shown that it is as good as that formed using conventional hotplate based approach, but reducing the bonding time by a factor of ~100. ©2008 IEEE.

Original language	English
Title of host publication	Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages	1225-1229
Number of pages	5
DOIs	https://doi.org/10.1109/ESTC.2008.4684528
Publication status	Published - 2008
Event	2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008

Conference

Conference	2008 2nd Electronics Systemintegration Technology Conference
Abbreviated title	ESTC
Country/Territory	United Kingdom
City	Greenwich
Period	1/09/08 → 4/09/08

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10.1109/ESTC.2008.4684528

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title = "Laser assisted polymer bonding technology for advanced MEMS packaging",

abstract = "This paper presents the development of a laser assisted polymer bonding process using benzocyclobutene (BCB) for encapsulation of MEMS and other microscale sensor devices. The polymer rings were fabricated on capping substrates using the photosensitive BCB resin and photolithography and then bonded onto device substrates to form microcavities for MEMS packaging. A high-power fibre-coupled diode laser at the wavelength of 970 nm was used as the heat source for BCB bonding/curing in conjunction with novel beam forming optics that allows selective illumination of the substrates to be joined. Defect free bonding was realised in 10 seconds using laser power of order 50 Wand 1 kgf of bonding force. The quality of the laser produced polymer bond was assessed using optical inspection and leak test and it was shown that it is as good as that formed using conventional hotplate based approach, but reducing the bonding time by a factor of ~100. {\textcopyright}2008 IEEE.",

author = "J. Zeng and Wang, {C. H.}",

year = "2008",

doi = "10.1109/ESTC.2008.4684528",

language = "English",

isbn = "9781424428144",

pages = "1225--1229",

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note = "2008 2nd Electronics Systemintegration Technology Conference, ESTC ; Conference date: 01-09-2008 Through 04-09-2008",

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TY - GEN

T1 - Laser assisted polymer bonding technology for advanced MEMS packaging

AU - Zeng, J.

AU - Wang, C. H.

PY - 2008

Y1 - 2008

N2 - This paper presents the development of a laser assisted polymer bonding process using benzocyclobutene (BCB) for encapsulation of MEMS and other microscale sensor devices. The polymer rings were fabricated on capping substrates using the photosensitive BCB resin and photolithography and then bonded onto device substrates to form microcavities for MEMS packaging. A high-power fibre-coupled diode laser at the wavelength of 970 nm was used as the heat source for BCB bonding/curing in conjunction with novel beam forming optics that allows selective illumination of the substrates to be joined. Defect free bonding was realised in 10 seconds using laser power of order 50 Wand 1 kgf of bonding force. The quality of the laser produced polymer bond was assessed using optical inspection and leak test and it was shown that it is as good as that formed using conventional hotplate based approach, but reducing the bonding time by a factor of ~100. ©2008 IEEE.

AB - This paper presents the development of a laser assisted polymer bonding process using benzocyclobutene (BCB) for encapsulation of MEMS and other microscale sensor devices. The polymer rings were fabricated on capping substrates using the photosensitive BCB resin and photolithography and then bonded onto device substrates to form microcavities for MEMS packaging. A high-power fibre-coupled diode laser at the wavelength of 970 nm was used as the heat source for BCB bonding/curing in conjunction with novel beam forming optics that allows selective illumination of the substrates to be joined. Defect free bonding was realised in 10 seconds using laser power of order 50 Wand 1 kgf of bonding force. The quality of the laser produced polymer bond was assessed using optical inspection and leak test and it was shown that it is as good as that formed using conventional hotplate based approach, but reducing the bonding time by a factor of ~100. ©2008 IEEE.

U2 - 10.1109/ESTC.2008.4684528

DO - 10.1109/ESTC.2008.4684528

M3 - Conference contribution

SN - 9781424428144

SP - 1225

EP - 1229

BT - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

T2 - 2008 2nd Electronics Systemintegration Technology Conference

Y2 - 1 September 2008 through 4 September 2008

ER -

Laser assisted polymer bonding technology for advanced MEMS packaging

Abstract

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