Lamination based embossing technique for LTCC

Stefan Peter Wilhelm; Robert W Kay; Mazher-Iqbal Mohammed; Yves Lacrotte; Marc Phillipe Yves Desmulliez

doi:10.1007/s00542-012-1702-y

Lamination based embossing technique for LTCC

Stefan Peter Wilhelm
, Robert W Kay
, Mazher-Iqbal Mohammed
, Yves Lacrotte
, Marc Phillipe Yves Desmulliez

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.

Original language	English
Pages (from-to)	801-807
Number of pages	7
Journal	Microsystem Technologies
Volume	19
Issue number	6
DOIs	https://doi.org/10.1007/s00542-012-1702-y
Publication status	Published - 1 Jun 2013

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@article{e8400b24980c4a5c9fa1972084aa165e,

title = "Lamination based embossing technique for LTCC",

abstract = "This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.",

author = "Wilhelm, \{Stefan Peter\} and Kay, \{Robert W\} and Mazher-Iqbal Mohammed and Yves Lacrotte and Desmulliez, \{Marc Phillipe Yves\}",

year = "2013",

month = jun,

day = "1",

doi = "10.1007/s00542-012-1702-y",

language = "English",

volume = "19",

pages = "801--807",

journal = "Microsystem Technologies",

issn = "0946-7076",

publisher = "Springer Verlag",

number = "6",

}

TY - JOUR

T1 - Lamination based embossing technique for LTCC

AU - Wilhelm, Stefan Peter

AU - Kay, Robert W

AU - Mohammed, Mazher-Iqbal

AU - Lacrotte, Yves

AU - Desmulliez, Marc Phillipe Yves

PY - 2013/6/1

Y1 - 2013/6/1

N2 - This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.

AB - This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.

U2 - 10.1007/s00542-012-1702-y

DO - 10.1007/s00542-012-1702-y

M3 - Article

SN - 0946-7076

VL - 19

SP - 801

EP - 807

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 6

ER -

Lamination based embossing technique for LTCC

Abstract

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