Lamination based embossing technique for LTCC

Stefan Peter Wilhelm, Robert W Kay, Mazher-Iqbal Mohammed, Yves Lacrotte, Marc Phillipe Yves Desmulliez

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8 Citations (Scopus)

Abstract

This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.

Original languageEnglish
Pages (from-to)801-807
Number of pages7
JournalMicrosystem Technologies
Volume19
Issue number6
DOIs
Publication statusPublished - 1 Jun 2013

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