Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

David Flynn; Marc Phillipe Yves Desmulliez; Yingtao Tian; Changqing  Liu; David Hutt; bob stevens

Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

David Flynn, Marc Phillipe Yves Desmulliez, Yingtao Tian, Changqing Liu, David Hutt, bob stevens

Research output: Contribution to conference › Paper › peer-review

Abstract

Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.

Original language	English
Publication status	Published - 8 Aug 2011
Event	12th International Conference on Electronic Packaging Technology and High Density Packaging - Shanghai Riverfront Business Hotel, Shanghai, China Duration: 8 Aug 2011 → 11 Aug 2011 Conference number: 12345941 http://ieeexplore.ieee.org/document/6066937/

Conference

Conference	12th International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated title	ICEPT-HDP
Country/Territory	China
City	Shanghai
Period	8/08/11 → 11/08/11
Other	Covers the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.
Internet address	http://ieeexplore.ieee.org/document/6066937/

Keywords

indium
current density
Manufacturing

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http://ieeexplore.ieee.org/document/6066937/

Cite this

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title = "Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation",

abstract = "Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.",

keywords = "indium, current density, Manufacturing",

author = "David Flynn and Desmulliez, {Marc Phillipe Yves} and Yingtao Tian and Changqing Liu and David Hutt and bob stevens",

year = "2011",

month = aug,

day = "8",

language = "English",

note = "12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP ; Conference date: 08-08-2011 Through 11-08-2011",

url = "http://ieeexplore.ieee.org/document/6066937/",

}

Flynn, D , Desmulliez, MPY, Tian, Y, Liu, C, Hutt, D & stevens, B 2011, 'Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation', Paper presented at 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, 8/08/11 - 11/08/11. <http://ieeexplore.ieee.org/document/6066937/>

Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. / Flynn, David ; Desmulliez, Marc Phillipe Yves; Tian, Yingtao et al.

2011. Paper presented at 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

AU - Flynn, David

AU - Desmulliez, Marc Phillipe Yves

AU - Tian, Yingtao

AU - Liu, Changqing

AU - Hutt, David

AU - stevens, bob

N1 - Conference code: 12345941

PY - 2011/8/8

Y1 - 2011/8/8

N2 - Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.

AB - Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.

KW - indium

KW - current density

KW - Manufacturing

M3 - Paper

T2 - 12th International Conference on Electronic Packaging Technology and High Density Packaging

Y2 - 8 August 2011 through 11 August 2011

ER -

Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

Abstract

Conference

Keywords

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