Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

David Flynn, Marc Phillipe Yves Desmulliez, Yingtao Tian, Changqing Liu, David Hutt, bob stevens

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.
Original languageEnglish
Publication statusPublished - 8 Aug 2011
Event12th International Conference on Electronic Packaging Technology and High Density Packaging - Shanghai Riverfront Business Hotel, Shanghai, China
Duration: 8 Aug 201111 Aug 2011
Conference number: 12345941
http://ieeexplore.ieee.org/document/6066937/

Conference

Conference12th International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated titleICEPT-HDP
CountryChina
CityShanghai
Period8/08/1111/08/11
OtherCovers the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.
Internet address

Keywords

  • indium
  • current density
  • Manufacturing

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