Integration of IC technology with MEMS

silicon+ technology for the future

A J Walton, J T M Stevenson, I Underwood, J Terry, S Smith, W Parkes, C Dunare, H Lin, Y Li, R Henderson, D Renshaw, K Muir, Marc Phillipe Yves Desmulliez, David Flynn, M J MacIntosh, W S Holland, A F Murray, T B Tang, A Bunting, A M Gundlach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2007 IET Seminar on Micro Electro-Mechanical Systems
PublisherInstitution of Engineering and Technology
Number of pages11
ISBN (Print)9780863418075, 9781605600307
Publication statusPublished - 2007
Event2007 IET Seminar on Micro Electro-Mechanical Systems - London, United Kingdom
Duration: 25 Apr 200725 Apr 2007

Conference

Conference2007 IET Seminar on Micro Electro-Mechanical Systems
CountryUnited Kingdom
CityLondon
Period25/04/0725/04/07

Cite this

Walton, A. J., Stevenson, J. T. M., Underwood, I., Terry, J., Smith, S., Parkes, W., ... Gundlach, A. M. (2007). Integration of IC technology with MEMS: silicon+ technology for the future. In 2007 IET Seminar on Micro Electro-Mechanical Systems Institution of Engineering and Technology.
Walton, A J ; Stevenson, J T M ; Underwood, I ; Terry, J ; Smith, S ; Parkes, W ; Dunare, C ; Lin, H ; Li, Y ; Henderson, R ; Renshaw, D ; Muir, K ; Desmulliez, Marc Phillipe Yves ; Flynn, David ; MacIntosh, M J ; Holland, W S ; Murray, A F ; Tang, T B ; Bunting, A ; Gundlach, A M. / Integration of IC technology with MEMS : silicon+ technology for the future. 2007 IET Seminar on Micro Electro-Mechanical Systems. Institution of Engineering and Technology, 2007.
@inproceedings{2cac107901c5482f9cc80d9453b40e4a,
title = "Integration of IC technology with MEMS: silicon+ technology for the future",
author = "Walton, {A J} and Stevenson, {J T M} and I Underwood and J Terry and S Smith and W Parkes and C Dunare and H Lin and Y Li and R Henderson and D Renshaw and K Muir and Desmulliez, {Marc Phillipe Yves} and David Flynn and MacIntosh, {M J} and Holland, {W S} and Murray, {A F} and Tang, {T B} and A Bunting and Gundlach, {A M}",
year = "2007",
language = "English",
isbn = "9780863418075",
booktitle = "2007 IET Seminar on Micro Electro-Mechanical Systems",
publisher = "Institution of Engineering and Technology",
address = "United Kingdom",

}

Walton, AJ, Stevenson, JTM, Underwood, I, Terry, J, Smith, S, Parkes, W, Dunare, C, Lin, H, Li, Y, Henderson, R, Renshaw, D, Muir, K, Desmulliez, MPY, Flynn, D, MacIntosh, MJ, Holland, WS, Murray, AF, Tang, TB, Bunting, A & Gundlach, AM 2007, Integration of IC technology with MEMS: silicon+ technology for the future. in 2007 IET Seminar on Micro Electro-Mechanical Systems. Institution of Engineering and Technology, 2007 IET Seminar on Micro Electro-Mechanical Systems, London, United Kingdom, 25/04/07.

Integration of IC technology with MEMS : silicon+ technology for the future. / Walton, A J; Stevenson, J T M; Underwood, I; Terry, J; Smith, S; Parkes, W; Dunare, C; Lin, H; Li, Y; Henderson, R; Renshaw, D; Muir, K; Desmulliez, Marc Phillipe Yves; Flynn, David; MacIntosh, M J; Holland, W S; Murray, A F; Tang, T B; Bunting, A; Gundlach, A M.

2007 IET Seminar on Micro Electro-Mechanical Systems. Institution of Engineering and Technology, 2007.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Integration of IC technology with MEMS

T2 - silicon+ technology for the future

AU - Walton, A J

AU - Stevenson, J T M

AU - Underwood, I

AU - Terry, J

AU - Smith, S

AU - Parkes, W

AU - Dunare, C

AU - Lin, H

AU - Li, Y

AU - Henderson, R

AU - Renshaw, D

AU - Muir, K

AU - Desmulliez, Marc Phillipe Yves

AU - Flynn, David

AU - MacIntosh, M J

AU - Holland, W S

AU - Murray, A F

AU - Tang, T B

AU - Bunting, A

AU - Gundlach, A M

PY - 2007

Y1 - 2007

M3 - Conference contribution

SN - 9780863418075

SN - 9781605600307

BT - 2007 IET Seminar on Micro Electro-Mechanical Systems

PB - Institution of Engineering and Technology

ER -

Walton AJ, Stevenson JTM, Underwood I, Terry J, Smith S, Parkes W et al. Integration of IC technology with MEMS: silicon+ technology for the future. In 2007 IET Seminar on Micro Electro-Mechanical Systems. Institution of Engineering and Technology. 2007