Integration of IC technology with MEMS: silicon+ technology for the future

A J Walton, J T M Stevenson, I Underwood, J Terry, S Smith, W Parkes, C Dunare, H Lin, Y Li, R Henderson, D Renshaw, K Muir, Marc Phillipe Yves Desmulliez, David Flynn, M J MacIntosh, W S Holland, A F Murray, T B Tang, A Bunting, A M Gundlach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
Original languageEnglish
Title of host publication2007 IET Seminar on Micro Electro-Mechanical Systems
PublisherInstitution of Engineering and Technology
Number of pages11
ISBN (Print)9780863418075, 9781605600307
Publication statusPublished - 2007
Event2007 IET Seminar on Micro Electro-Mechanical Systems - London, United Kingdom
Duration: 25 Apr 200725 Apr 2007

Conference

Conference2007 IET Seminar on Micro Electro-Mechanical Systems
CountryUnited Kingdom
CityLondon
Period25/04/0725/04/07

Cite this

Walton, A. J., Stevenson, J. T. M., Underwood, I., Terry, J., Smith, S., Parkes, W., Dunare, C., Lin, H., Li, Y., Henderson, R., Renshaw, D., Muir, K., Desmulliez, M. P. Y., Flynn, D., MacIntosh, M. J., Holland, W. S., Murray, A. F., Tang, T. B., Bunting, A., & Gundlach, A. M. (2007). Integration of IC technology with MEMS: silicon+ technology for the future. In 2007 IET Seminar on Micro Electro-Mechanical Systems Institution of Engineering and Technology.